Title:
STRUCTURE AND METHOD FOR FLIP CHIP MOUNTING AND FLIP CHIP
Document Type and Number:
Japanese Patent JP2940491
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve long-term reliability between a semiconductor chip and a base board in semiconductor chip resin-sealing for a multichip module.
SOLUTION: A semiconductor chip 1 is provided with bumps 2 on the electrodes to be connected with a base board 6, and is connected with the base board 6 with solder 3. On the base board 6, a chip pad 5 for connecting with the bumps 2 of the semiconductor chip 1 and a pattern and a resist 8 which constitute an electric circuit are provided. A through hole 12, which electrically connects layers on the base board, and a land 7, which connects with the through hole 12, are not arranged on the part along the edge of the semiconductor chip 1 on the base board 6. A process of applying sealing resin 4 between the semiconductor chip 1 and the base board 6 after mounting the semiconductor chip 1 on the base board 6 is smoothly performed, since there is not land 7 at the periphery of the semiconductor chip 1.
Inventors:
NAKAO YASUSHI
Application Number:
JP27450796A
Publication Date:
August 25, 1999
Filing Date:
October 17, 1996
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
H01L23/28; H01L25/04; H01L25/18; H05K1/02; H05K1/18; H05K3/34; (IPC1-7): H01L25/04; H01L25/18
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)
Previous Patent: MANUFACTURE OF MOUTH RING METAL FITTING FOR HOSE AND MANUFACTURE OF BRAKE HOSE
Next Patent: OPTION PARTS MATCHING RETRIEVAL SYSTEM
Next Patent: OPTION PARTS MATCHING RETRIEVAL SYSTEM