Title:
STRUCTURE AND METHOD FOR MOUNTING BGA-TYPE SEMICONDUCTOR PACKAGE
Document Type and Number:
Japanese Patent JP3532450
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve service life of a connection part, and to easily repair failure, when the failure is detected, by partially including a reinforcing resin in the gap between a BGA(ball grid array)-type semiconductor package and a mounting substrate.
SOLUTION: BGA-type semiconductor packages 1 are electrically connected to a mounting substrate 2, a reinforcing resin 4 is partially provided at four corners of the gap between the BGA-type semiconductor packages 1 and the mounting substrate 2, and the reinforcing resin 4 is used for reinforcing a bump connection part 3 for electrically connecting the BGA-type packages 1 to the mounting substrate 2. Then, the coefficient of thermal expansion of the bump connection part 3 is allowed to made to match with that of the reinforcing resin 4, thus improving the life of the connection part and easily repairing failure, when a failure is found.
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Inventors:
Yasuda, Masao
Sumikawa, Masahito
Sumikawa, Masahito
Application Number:
JP10847399A
Publication Date:
May 31, 2004
Filing Date:
April 15, 1999
Export Citation:
Assignee:
SHARP CORP
International Classes:
H01L23/12; H01L21/56; H01L21/60; (IPC1-7): H01L21/60; H01L21/56; H01L23/12
Attorney, Agent or Firm:
原 謙三
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