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Patent Searching and Data


Title:
STRUCTURE AND METHOD FOR PACKAGING CAPACITOR AND CAPACITOR
Document Type and Number:
Japanese Patent JP2000269076
Kind Code:
A
Abstract:

To expand, add, or select characteristics by providing a connection means for connecting a sub capacitor or other parts to a main capacitor for obtaining specific characteristics.

A main capacitor 1 is a large-capacity capacitor such as a square-type surface-mount tantalum solid electrolytic capacitor with a main capacitor electrode 1a that becomes the terminal of a thick-film conductor at both ends at the nucleus of the capacitor. Also, the main capacitor 1 is joined to a sub capacitor 2 such as a square-type surface-mount lamination ceramic capacitor (capacitor) with a sub capacitor electrode 2a at both ends. Then, the main capacitor 1 is provided with a connection means 3 for soldering or engaging the sub capacitor 2 to the surface of the main capacitor 1 by forming a thick-film conductor, a thin-film conductor, or a metal plate conductor. Also, the sub capacitor 2 is a capacitor with a small capacity with a terminal for joining to the main capacitor 1 at both ends and has smaller external dimensions than the main capacitor 1.


Inventors:
HASHIMOTO ATSUSHI
Application Number:
JP7555899A
Publication Date:
September 29, 2000
Filing Date:
March 19, 1999
Export Citation:
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Assignee:
PFU LTD
International Classes:
H01G4/38; (IPC1-7): H01G4/38