STRUCTURE AND METHOD FOR PACKAGING SUBSTRATE

Japanese Patent JP2006156544

A

To facilitate the alignment of bumps on two substrates for appropriately connecting the bumps each other in the packaging structure of the substrate in which the two substrates having the bumps at one-surface side each are connected by crimping the bumps each other.

The bumps 10, 20 are provided at each one-side surface of the first and second substrates 100, 200. The tip 11 of the bump 10 at the side of the first substrate 100 is set to be a flat surface. The tip of the bump 20 at the side of the second substrate 200 is set to be a projection 21 that is narrower than the tip 11 of the bump 10 at the side of the first substrate 100. Widths A, B of the tip 11, 21 in the bumps 10, 20 on both the substrates are prescribed so that the tip 21 of the bump 20 at the side of the second substrate 200 is positioned within the range of tip 11 of the bump 10 at the side of the first substrate 100, even if misalignment in the plane direction of both the substrates occurs while each one surface of both the substrates 100, 200 opposes each other.

JP6672837	Adhesive conductive adhesive compositions, film-like adhesives, connection structures and semiconductor devices
JP2002289656	LAMINATED FILM AND SEMICONDUCTOR DEVICE USING IT
JPS51147256	ULTRA HIGH DENSITY INTEGRATED CIRCUIT BOARD

ISHIKAWA KATSUMI
TAKEI HIROSHI
MAKINO SHINYA
YANO TETSURO

JP2004342115A

June 15, 2006

November 26, 2004

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DENSO CORP

H01L21/60

JPH118269A	1999-01-12
JPH1187425A	1999-03-30
JP2000133672A	2000-05-12
JPH07183303A	1995-07-21
JP2003523085A	2003-07-29
JP2001144143A	2001-05-25
JPH06310565A	1994-11-04
JP2004260033A	2004-09-16

Yoji Ito
Takahiro Miura
Fumihiro Mizuno

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