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Patent Searching and Data


Title:
STRUCTURE AND METHOD FOR SEALING THROUGH HOLE
Document Type and Number:
Japanese Patent JP2014095415
Kind Code:
A
Abstract:

To provide a structure and a method for sealing a through hole which secure sufficient water tightness to improve the seal performance regardless of the number of pipelines inserted into the through hole formed in a construction.

A through hole sealing structure includes: a support ring 21 disposed around three pipelines 13; a seal material 22 filling a space part 24 between the support ring 21 and the three pipelines 13; and a ring shaped boot member 23 which connects the support ring 21 with a sleeve 14 fixed to the through hole 12.


Inventors:
IWATA TOMOKAZU
TSUMURA YASUHIRO
KONDO YUJI
SAKAGUCHI YUKIHIRO
FUKUYA YASUTAKA
IWAMOTO YOICHI
MUROYA ITARU
Application Number:
JP2012246659A
Publication Date:
May 22, 2014
Filing Date:
November 08, 2012
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD
International Classes:
F16L5/02; E04F17/08; F16J15/06; F16J15/14; F16J15/16; F16J15/52
Domestic Patent References:
JP2008255581A2008-10-23
JP2012045120A2012-03-08
JPH0828760A1996-02-02
JP2007093122A2007-04-12
JP2008131733A2008-06-05
JPS58118377U1983-08-12
JP2004340192A2004-12-02
JPS6358835U1988-04-19
JPH10224960A1998-08-21
JPS5238744Y21977-09-02
JPS61175374A1986-08-07
JPS6252289A1987-03-06
Foreign References:
US5266743A1993-11-30
Attorney, Agent or Firm:
Hiroaki Sakai
Jun Takamura