To enable a heat dissipating plate to be easily dismounted for recycling from a printed circuit board provided with a heat dissipating plate used for dissipating heat from a power device such as a FET or an IGBT.
First engaging grooves 23 are provided on a printed circuit board 20, legs 11 of a heat dissipating plate 10 are each inserted into the engaging grooves 23 and translated to engage the printed circuit board 20 with second grooves 14 which are each provided to the legs 11. The legs 11 are each soldered to soldering lands 25 each provided to the rear of the circuit board 20 adjacent to the first engaging grooves 23. When the printed circuit board 20 is recycled, a bending force is applied to it at spots located sandwiching the first engaging grooves 23 and breaking holes 24 provided to the board along the extensions of the grooves 23 to fracture the printed circuit board 20, and the parts of the legs 11 of the heat dissipating plate 10 soldered to the circuit board 20 are exposed.
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