PURPOSE: To prevent a sealing resin from separating from an outer circuit board in operation by a method wherein a semiconductor chip is bonded to the bottom of a recess with a bonding agent, the protrudent electrodes of the semiconductor chip are connected to the conductive pattern of the outer circuit board with a wire, and the semiconductor chip inside the recess and a part of the conductive pattern around the chip are sealed off with a sealing resin.

CONSTITUTION: A semiconductor chip 11 is bonded to the base of a recess 15 with an adhesive agent provided to a non-conductive surface 13a of an outer circuit board 13. In succession, the bonding pad 12 of the semiconductor chip 11 is connected to the tip 14a of a conductive pattern 14 formed on the outer circuit board 13 with a wire 16 such as a gold wire or the like. Thereafter, a sealing resin 17 is provided onto the outer circuit board 13 through potting and heated, whereby the semiconductor chip 11 inside the recess 15 and a part of the conductive pattern 14 around it are sealed off with the partially cured sealing resin 17 to finish the mounting of the semiconductor chip 11. Even if the semiconductor chip 11 is warped to enable the sealing resin 17 to separate from the non-conductive surface 13a of the outer circuit board 13, the sealing resin 17 is prevented from separating as the part located at the dovetail groove-shaped recess 15 is stopped from peeling off by the recess 15.