Title:
STRUCTURE FOR MOUNTING SENSOR COMPONENT ON BOARD
Document Type and Number:
Japanese Patent JP3714400
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a structure for mounting a sensor component on a board horizontally without directly bending the lead leg part of the sensor component, nor causing performance deterioration of the sensor components, and by such structure, the sensor component can be mounted on the board at an accurate position without using any holders, and the costs can be reduced by reducing the number of components.
SOLUTION: After the sensor components 1 and 2 are mounted on the board 3, a part being located nearly at the center of plated wire 4 on the board 3 is bent while the plated wire 4 is provided on the board 3, and bending pieces 5 and 6 are retained vertically by the plated wire 4 so that the sensor components 1 and 2 that are mounted at the bending pieces 5 and 6 become nearly horizontal.
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Inventors:
Naga Isao
Application Number:
JP2000209186A
Publication Date:
November 09, 2005
Filing Date:
July 11, 2000
Export Citation:
Assignee:
Funai Electric Co., Ltd.
International Classes:
H05K1/18; G01D5/36; H05K1/02; H05K1/14; (IPC1-7): H05K1/14; G01D5/36; H05K1/02
Domestic Patent References:
| JP1167621U | ||||
| JP61162071U | ||||
| JP5055571U | ||||
| JP59039965U | ||||
| JP60107521A | ||||
| JP52013667A |