Title:
STRUCTURE FOR MOUNTING WIRING BOARD FOR HIGH FREQUENCY
Document Type and Number:
Japanese Patent JP3261094
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a structure for mounting a wiring board which is capable of transmitting high-frequency signals at a low transmission loss, without deteriorating the characteristics and is superior in transmission property, while preventing reflection of signals on the mounting part.
SOLUTION: This wiring board for high frequency is provided with a dielectric substrate 2, a semiconductor element 5 for high frequency mounted on its surface, a first signal transmission line 7 which is formed on the surface of the dielectric substrate 2 and is connected with the semiconductor element 5, and a second signal transmission line 8 formed on the rear surface of the dielectric substrate 2, and it is formed by connecting the first signal transmission line 7 with the second signal transmission line 8. Further, the wiring board for high frequency is mounted to the wiring layer 12 of an outer circuit substrate 10 by means of a connecting part formed at the termination part of the second signal transmission line 7. In this case, a region 11 formed of material having a permittivity lower than that of the dielectric substrate and outer circuit substrate is provided on the surface of the outer circuit substrate 10 immediately below the joint part of the first and second signal transmission lines 7 and 8.
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Inventors:
Kenji Kitazawa
Shinichi Koriyama
Shinichi Koriyama
Application Number:
JP11821298A
Publication Date:
February 25, 2002
Filing Date:
April 28, 1998
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H05K1/18; H01L21/60; H01L23/12; (IPC1-7): H05K1/18; H01L21/60; H01L23/12
Domestic Patent References:
| JP1074863A | ||||
| JP10107448A |