PURPOSE: To align the position of a sensor chip to a stem simply and to reduce the cost of a sensor.

CONSTITUTION: As a bonding head for bonding a sensor chip 48, a stem 50, whose material is cobalt alloy and the like having the thermal expansion coefficient close to those of a glass stage 24, a semiconductor pellet 20 and the like, and which contains hermetic seals 52 for lead pins 51 formed of glass, is provided. A recess part 54 having the shape for controlling the operating range of a weight 16 of a sensor is formed in the stem 50. A size (a) of the sensor chip 48 facing the recess part 54 is smaller than a size (b) of the opening part of the recess part 54 and larger than a size (c) of the bottom part of the recess part 54. The sensor chip 48 is die-bonded so that the chip enters into the recess part 54. Thus, the position alignment of the sensor chip 48 with the stem 50 can be achieved simply, and the cost can be reduced.