To provide structure of a plate type heatpipe capable of preventing a crack from being generated by thermal fatigue, in a junction portion between the plate type heatpipe and a heat generation source, and a method of manufacturing the same.

A body 1 of the plate type heatpipe comprises a metal plate body 11 and a ceramic plate body 12, and the metal plate body 11 and the ceramic plate body 12 are joined opposedly each other, to partition therebetween a space serving as a chamber 13. Wick structure 14 comprising a powdery sintered body, a metal mesh body or the like is formed on a chamber inner wall face, support structure 15 comprising a metal column is arranged to connect the metal plate body 11 to the ceramic plate body 12, and an inside of the chamber is exhausted and evacuated to fill a working fluid. The ceramic plate body is brought into direct junction of the ceramic plate body constituting a package such as a CPU unit to the heat generation source of the CPU unit or the like, to allow heat conduction, and a difference in thermal expansion coefficients is thereby reduced therebetween.