Title:
STRUCTURE FOR SEMICONDUCTOR SENSOR UNIT
Document Type and Number:
Japanese Patent JPH0212029
Kind Code:
A
Abstract:
PURPOSE:To simplify the shape of respective parts, to facilitate the processing of the parts and to reduce cost by making the structure of a semiconductor sensor unit the two-body structure of a substrate and a pipe-like member. CONSTITUTION:A sensor chip 1 which is hermetically fixed to a pedestal 3 is made to softly adhere to the substrate 7 and fixed on the substrate 7 by covering the outside of the chip 1 with the pipe-like member 6 after it is electrically connected to the substrate 7 by bonding. Next, the sensor unit is completed by being filled with a gel-like material 4 and a rubber-like material 5 in order to protect the surface of the chip 1. In such a case, the electric conducting between the inside and the outside of the substrate 7 is executed by a through- hole 8. Due to that, if the hole 8 is positioned on the outside of the member 6 even in a state where the hole 8 is to big to keep positioning accuracy, the material 4 can be prevented from flowing out and the occurrence of faulty conducting caused by a disconnection crack which occurs as the result that the hole 8 is too small can be prevented. Therefore, the shape of the parts can be simplified and the working of the parts can be facilitated. Besides, the cost can be reduced.
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Inventors:
SAKO YUKITOSHI
Application Number:
JP16353788A
Publication Date:
January 17, 1990
Filing Date:
June 29, 1988
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
G01L9/04; G01L9/00; (IPC1-7): G01L9/04
Domestic Patent References:
| JPS62194431A | 1987-08-26 | |||
| JPS61128575A | 1986-06-16 |
Attorney, Agent or Firm:
Masanori Ueyanagi (1 outside)
Next Patent: JPH0212030