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Title:
構造物の強度予測方法、構造物の造形方法、構造物の積層造形支援方法およびプログラム
Document Type and Number:
Japanese Patent JP6762744
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a structure strength prediction method capable of accurately predicting strength of structures molded by a lamination molding method.SOLUTION: This structure strength prediction method is a method for predicting the strength of a structure 3 molded by a lamination molding method, which acquires a lamination method of a material 31 including at least one selected from scanning direction, scanning pitch, lamination direction, and lamination pitch of the material 31, and estimates the strength of the structure 3 while considering anisotropy of the strength by the lamination method of the material 31.SELECTED DRAWING: Figure 8

Inventors:
Keiko Suda
Takamitsu Yamada
Application Number:
JP2016066225A
Publication Date:
September 30, 2020
Filing Date:
March 29, 2016
Export Citation:
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Assignee:
Toray Engineering Co., Ltd.
International Classes:
B29C64/10; B29C64/386; B33Y10/00; B33Y50/00; G06F30/23
Domestic Patent References:
JP2010085986A
JP2303817A
JP2017154500A
JP2015088062A
Attorney, Agent or Firm:
Hirokazu Miyazono



 
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