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Title:
STRUCTURE OF SUBSTRATE TERMINAL, TAPE CARRIER PACKAGE PROVIDED WITH IT, AND PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JPH10261853
Kind Code:
A
Abstract:

To improve the connection stability between electrically connected terminals by using an adhesive containing conductive particles.

Insulating layers 13 are provided among the conductor terminals 11 of a printed wiring board or a tape carrier package(TCP) or between a flexible connector and the conductors 21 of a flexible wiring board so as to relieve the steps of the conductors 21. The upper surfaces of the insulating layers 13 reduce the connection resistance between electrically connected terminals and remarkably improve the connection stability between the terminals by remarkably increasing the number of conductive particles 24a contributing to the connection between the terminals by preventing the bending of the connector 20 or wiring board by absorbing the pressure when the connector 20 is presscontacted with the wiring board. In addition, since the insulating layers 13 remarkably reduce such cavities 30 that may not be filled up sufficiently with an adhesive 23 when the connector 20 is press-contacted with the wiring board by using the adhesive 23, the retaining force of the adhesive 23 is sufficiently exerted and the connection reliability between the terminals is improved.


Inventors:
WADA KENJI
Application Number:
JP6517897A
Publication Date:
September 29, 1998
Filing Date:
March 18, 1997
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
H01L21/60; H05K1/11; H05K3/32; H05K3/34; H05K3/36; (IPC1-7): H05K1/11; H01L21/60
Attorney, Agent or Firm:
Kisaburo Suzuki (2 outside)