Title:
STRUCTURE USING DIAMOND COMPOSITE SUBSTANCE AND HEAT SINK AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JPH02170452
Kind Code:
A
Abstract:
PURPOSE: To display an excellent heat radiating function by composing the heat sink to be provided to the semiconductor device by using a heat-conductive compound consisting of diamond particles embedded in a metal matrix and making the compound and a semiconductor equal in coefficient of thermal expansion. CONSTITUTION: The diamond particles used for the heat sink are of approximately 3μm in particle size, and their surfaces are coated with metal which has high heat conductivity such as copper, silver, gold and Al at need when mixed with the metal matrix. Further, the ratio of the diamond particle to not less than one kinds of metal in the mixture is so selected that the compound and a semiconductor to be combined are substantially equal in coefficient of thermal expansion. Therefore, the difference in coefficient of thermal expansion between the combined mixture and semiconductor should be approximately <=0.5×10<-6> / deg.C. Further, an adhesive, etc., is used to bond the mixture and semiconductor together.
Inventors:
ROBAATO DANAA BAANHAMU
RIKARUDO SAIMON SASUMAN
RIKARUDO SAIMON SASUMAN
Application Number:
JP27056089A
Publication Date:
July 02, 1990
Filing Date:
October 11, 1989
Export Citation:
Assignee:
AMOCO CORP
International Classes:
C22C26/00; H01L23/373; (IPC1-7): H01L23/373
Attorney, Agent or Firm:
Tsuchiya Masaru
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