ASSEMBLY STRUCTURE OF FOT PACKAGE AND SUB CIRCUIT BOARD

Japanese Patent JP2016218166

A

PROBLEM TO BE SOLVED: To provide an assembly structure of a FOT package and a sub circuit board that facilitates adjustment of an optical axis of a light guide member provided in a light-transmitting hole of the package with the optical axis of the sub circuit board, and which is advantageous in terms of cost.SOLUTION: The assembly structure comprises: a sub circuit board 3 on which optical elements 6, 7 are mounted; a package 4 for accommodating the sub circuit board 3 which is mounted in the package 4 from an open part and having a light-transmitting hole formed at a position facing the optical elements 6, 7 mounted on the sub circuit board 3; and a lead frame 2 integrally molded in the package 4 while a plurality of lead pins 5, 8a are protruded outward from one peripheral wall side of the package 4. The package 4 has at least one projection part 12 for positioning in the inner wall, and the sub circuit board 3 has a projection receiving part 13 conforming to the projection part 12, allowing the sub circuit board 3 to be positioned relative to the package 4 by the projection part 12 and the projection receiving part 13.SELECTED DRAWING: Figure 1

YAMAGATA CHIEMI

JP2015100752A

December 22, 2016

May 18, 2015

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YAZAKI CORP

G02B6/42

JP2009237263A	2009-10-15
JP2011233500A	2011-11-17
JPH03117895U	1991-12-05
JPS6196432U	1986-06-20
JPH04259848A	1992-09-16
JP2009237263A	2009-10-15
JP2011233500A	2011-11-17
JPH03117895U	1991-12-05
JPS6196432U	1986-06-20
JPH04259848A	1992-09-16
JP2013004437A	2013-01-07
JP2011100033A	2011-05-19
JP2008071823A	2008-03-27
JP2013004437A	2013-01-07
JP2011100033A	2011-05-19
JP2008071823A	2008-03-27

Nobuo Nakamura
Shoichi Masuka

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