Title:
Structured adhesive tape
Document Type and Number:
Japanese Patent JP6326416
Kind Code:
B2
Abstract:
The invention relates to the use of an adhesive tape to adhesively bond printing plates, during which the impairment of the adhesive bonds by air bubble inclusions between the adhesive tape and a substrate should be reduced. This is achieved by using an adhesive tape comprising at least one adhesive layer, wherein the adhesive layer has at least one groove that does not extend to one of the edges of the adhesive layer, and the portion of the entire groove volume of the adhesive layer that is associated with such grooves is more than 50%.
Inventors:
Teboot Nils
Ebenau Stefan
Ebenau Stefan
Application Number:
JP2015529029A
Publication Date:
May 16, 2018
Filing Date:
August 29, 2013
Export Citation:
Assignee:
Theza Societas Europe
International Classes:
B41N1/12; C09J7/22; B41N6/00; C09J7/38; C09J201/00
Domestic Patent References:
| JP5246012A | ||||
| JP2009270111A |
Foreign References:
| WO2005100499A1 | ||||
| US5268228 |
Attorney, Agent or Firm:
Mitsufumi Esaki
Blacksmith
Katsunori Uenishi
Ichiro Torayama
Blacksmith
Katsunori Uenishi
Ichiro Torayama
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