Title:
構造体および無線通信装置
Document Type and Number:
Japanese Patent JP5931784
Kind Code:
B2
Abstract:
A first resin layer is provided with a step part formed in conformity with a shape of at least part of an electrically conductive pattern, and the first resin layer and a second resin layer closely adhere to each other in the step part.
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Inventors:
Akihiro Iriyama
Application Number:
JP2013059151A
Publication Date:
June 08, 2016
Filing Date:
March 21, 2013
Export Citation:
Assignee:
Sharp Corporation
International Classes:
H01Q1/40; H01Q1/24
Domestic Patent References:
| JP2011091788A | ||||
| JP2003234668A | ||||
| JP2010259038A | ||||
| JP11150414A | ||||
| JP62048105A |
Attorney, Agent or Firm:
Harakenzo world patent & trademark