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Patent Searching and Data


Title:
STUDLIKE FIXTURE, AND METHOD OF MOUNTING BUILDING BOARD USING THE FIXTURE
Document Type and Number:
Japanese Patent JP2007192278
Kind Code:
A
Abstract:

To provide a studlike fixture that facilitates the position adjustment and mounting of a building board when mounting the building board as a finishing material to a base material of the wall or ceiling of a building such as a house or the like and further that exhibits high strength after the building board has been mounted, and a method of mounting a building board using the fixture.

The studlike fixture comprises a heat and a needle arranged beneath the head. The fixture includes an adhesive capsule attached to the back surface of the head. The adhesive capsule is so formed as to be broken by press and contains an adhesive. By pressing the building board having the studlike fixtures attached to the back side thereof against the base material, the capsules are broken. As a result, the adhesive flows out between the building board and the base material and the needles of the studlike fixtures are driven into the base material, thereby securing the building board to the base material.

COPYRIGHT: (C)2007,JPO&INPIT


Inventors:
SHITAYA YOSHITAKA
Application Number:
JP2006010179A
Publication Date:
August 02, 2007
Filing Date:
January 18, 2006
Export Citation:
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Assignee:
DAIKEN TRADE & INDUSTRY
International Classes:
F16B15/02; E04F13/21