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Title:
STYRENE-BASED RESIN HAVING FEW LOW MOLECULAR WEIGHT COMPONENT AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
Japanese Patent JP2004315711
Kind Code:
A
Abstract:

To provide a styrene-based resin in which a low molecular weight component such as a monomer, a dimer or a trimer is removed in high efficiency and to provide a method for producing the styrene-based resin.

The styrene-based resin having few low molecular weight component is obtained by extracting and removing a low molecular weight component obtained by extracting low molecular weight component contained by bringing the styrene-based resin into contact with liquid paraffin. In the styrene-based resin having low molecular weight component and the liquid paraffin, (a) styrene monomer content is <500 ppm and (b) total amount of the styrene dimer and trimer is <5,000 ppm and (c) the liquid paraffin content is ≥50 ppm and <10 wt.%.


Inventors:
IKEMATSU TAKESHI
OTANI IKUJI
Application Number:
JP2003113708A
Publication Date:
November 11, 2004
Filing Date:
April 18, 2003
Export Citation:
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Assignee:
PS JAPAN CORP
International Classes:
C08F6/04; C08F12/00; (IPC1-7): C08F6/04; C08F12/00
Attorney, Agent or Firm:
Yoshio Narui
Takeshi Shimizu
Joi Ito
Hideo Takei