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Patent Searching and Data


Title:
STYRENE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP09143322
Kind Code:
A
Abstract:

To provide a styrene resin composition excellent in a balance among chemical resistance, mechanical strengths and moldability.

This styrene resin composition which, in the form of a molding, satisfies the relationships: 0.8≤x 3.0 and 0≤y≤0.54 (wherein x (wt.%) is the content of a styrene polymer of a molecular weight of 2,000,000 or above, and y (wt.%) is the content of a styrene polymer of a molecular weight of 3,000,000 or above), has a content of a styrene polymer of a molecular weight of 50,000 or below is 3.0-12.0wt.% and which has a molecular weight or 200,000-350,000 and a weight-average molecular weight of 200,000-500,000 in a molecular weight distribution curve as determined by GPC.


Inventors:
Tanda, Hisami
Arai, Teruo
Shichizawa, Atsushi
Application Number:
JP1995000309262
Publication Date:
June 03, 1997
Filing Date:
November 28, 1995
Export Citation:
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Assignee:
ASAHI CHEM IND CO LTD
International Classes:
C08L25/04; C08L25/00; C08L25/00; (IPC1-7): C08L25/04