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Title:
STYRENE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH06116457
Kind Code:
A
Abstract:

PURPOSE: To obtain a styrene resin compsn. which is excellent in antistatic properties and thermal stability and gives a molded article resistant to cleavage by compounding a styrene resin with a specific polyamide elastomer in a specified wt. ratio.

CONSTITUTION: The compsn. is prepd. by compounding 70-95wt.% styrene resin (e.g. PS) with 5-30wt.% polyamide elastomer which comprises a polyamide segment formed by the polycondensation of a diamine, a dicarboxylic acid, and an aminocarboxylic acid and consisting of polyamide blocks of formulae I and II (wherein R1 and R2 are each a divalent hydrocarbon group provided at least one of them is an arom hydrocarbon group; R3 is a 5-11C divalent hydrocarbon group; and n1 and n2 are each 1-20) in a molar ratio of the polyamide block of formula II to that of formula I of 0-10, a polyoxyalkylene segment contg. at least 50wt.% polyoxyethylene and having a number-average mol.wt. of 500-6,000, and a linking agent (a dicarboxylic acid, a diamine, or a diisocyanate) for linking the above two kinds of segment in a wt. ratio of the sum of the polyamide segment and the linking agent to the polyamide elastomer of 20-70wt.%.


Inventors:
ISHIBASHI YUZURU
KAWAKAMI KIYOSHI
Application Number:
JP27041292A
Publication Date:
April 26, 1994
Filing Date:
October 08, 1992
Export Citation:
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Assignee:
ASAHI CHEMICAL IND
International Classes:
C08G69/40; C08L25/04; C08L73/00; (IPC1-7): C08L25/04
Attorney, Agent or Firm:
Tetsuya Mori (2 others)



 
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