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Patent Searching and Data


Title:
SUBSTANTIALLY WRINKLE-FREE HIGHLY ELASTIC MODULUS NON-PLANAR FILM AND PROCESS THEREFOR
Document Type and Number:
Japanese Patent JP01241433
Kind Code:
A
Abstract:

PURPOSE: To obtain a wrinkle-free high modulus thermoplastic film by placing a heat-shrinkable high modulus thermoplastic film on a negative image mold of a non-planar article, and heating it to a glass transition temperature or higher while restricting it in its dimensions.

CONSTITUTION: A thermoplastic film is a film selected from the group consisting of a polyolefin film, polyamide film, polyurethane film, polycarbonate film, polyvinyl chloride film, polystyrene film and polyester film. A heat-shrinkable high modulus thermoplastic film is placed on a negative image mold of a non- planar article, heated to a glass transition temperature or higher while restricting the film in its dimensions, draped with a shape of the mold to a draped film. An adhesive layer is placed on the film, draped in a shape of the draped film by a heat and a pressure, laminated to manufacture a two-layer pre-laminated, thereby manufacturing the substantially wrinkle-free non-planar pre-laminate.


Inventors:
Farrar, Grover L.
Swofford, Wayne H.
Lazar, Jack M.
Inman, Samuel M.
Gust, Stephen J.
Application Number:
JP1989000015178
Publication Date:
September 26, 1989
Filing Date:
January 26, 1989
Export Citation:
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Assignee:
HOECHST CELANESE CORP
International Classes:
B29C33/02; B29C33/68; B29C61/02; B29C71/02; B32B1/00; B32B7/02; B32B7/12; B32B17/10; B32B27/08; B32B27/36; B60J1/02; B29K105/02; B29L7/00; (IPC1-7): B29C33/02; B29C33/68; B29C61/02; B29C71/02; B29K105/02; B29L7/00; B32B1/00; B32B7/02; B32B7/12; B32B27/08