Title:
SUBSTITUTED GOLD PLATING SOLUTION
Document Type and Number:
Japanese Patent JP3146757
Kind Code:
B2
Abstract:
PURPOSE: To improve the lowering in the toxicity of a plating solution and the adhesibility to a base metal by specifying the concn. of a non-cyan gold source, a sulfite and a metallic complexing agent of carboxylic acids and the pH of the plating solution and restricting the concn. of impurity ions such as ammonium and halogen.
CONSTITUTION: This substituted gold plating solution is composed of a composition containing 7-150 non-cyan gold source and sulfite, 0.5-100 metallic complexing agent of the carboxylic acids and the balance impurities by g/l. The metallic complexing agent is selected from salts of malonic acid, oxalic acid, glutaric acid, succinic acid, maleic acid, citraconic acid or the like. The impurities are restricted so as to be ≤0.02 ammonium ion concn., ≤0.3 chlorine ion concn., ≤0.3 sulfate ion concn., ≤0.03 bromine ion concn. and ≤0.006 iodine ion conc. by mol/l and the pH of the plating solution is adjusted to 5-12.
Inventors:
Akio Takahashi
Sumiko Nakashima
Shoshi Nakaso
Sumiko Nakashima
Shoshi Nakaso
Application Number:
JP12399693A
Publication Date:
March 19, 2001
Filing Date:
May 26, 1993
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C23C18/42; H05K3/24; (IPC1-7): C23C18/42
Domestic Patent References:
| JP6330333A | ||||
| JP6228761A |
Attorney, Agent or Firm:
Kunihiko Wakabayashi