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Title:
SUBSTRATE ADHESION APPARATUS AND METHOD FOR SEALING ORGANIC ELECTROLUMINESCENT DISPLAY USING SAME
Document Type and Number:
Japanese Patent JP2007227343
Kind Code:
A
Abstract:

To provide a substrate adhesion device capable of uniformly adhering two substrates with each other by providing a plate which allows two substrates to be adhered to engage with each other using uniform air pressure, and to provide a method for sealing an organic electroluminescent display using the same.

This device comprises a positioning plate including an air introduction port provided at one side, a plurality of discharge ports formed at an upper surface so as to communicate with the air introduction port for discharging introduced air, a groove formed so as to surround the plurality of discharge ports in a rectangular pattern, and an elastic member inserted into the groove with at least a part of the elastic member protruding to an outside of the groove in a state that external pressure is not applied to the elastic member; and a shaft mounted at a lower surface of the positioning plate for supporting and moving the positioning plate. After a first substrate is placed on the elastic member of the positioning plate, the positioning plate is vertically moved by the shaft.

COPYRIGHT: (C)2007,JPO&INPIT


Inventors:
LEE JONG WOO
Application Number:
JP2006222065A
Publication Date:
September 06, 2007
Filing Date:
August 16, 2006
Export Citation:
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Assignee:
SAMSUNG SDI CO LTD
International Classes:
H05B33/04; H01L51/50; H05B33/10
Domestic Patent References:
JPH04147217A1992-05-20
JPH06337429A1994-12-06
JPH0634983A1994-02-10
JPS63163423A1988-07-06
JP2004151656A2004-05-27
JP2006524419A2006-10-26
Foreign References:
WO2004095597A22004-11-04
US6671029B12003-12-30
Attorney, Agent or Firm:
Hidekazu Miyoshi
Masakazu Ito
Yuko Hara