To provide a substrate for manufacturing a thin plate, which can prevent the lowering in the substrate transfer efficiency caused by falling of burr and improve the efficiency of manufacturing the thin plate; to provide an apparatus for manufacturing the thin plate; and to provide a method for manufacturing the thin plate.
The surface of the substrate 10 for manufacturing the thin plate is dipped in a melt for forming the thin plate thereon by the solidification of the melt. The substrate 10 has a main body part 1 and a burr-receiving part 2. The main body part 1 includes a surface 6. The burr-receiving part 2 is connected to the faces except the surface 6 of the main body part 1 and extended to the outer side of the outer edge of the main body part 1, viewed from the side of the surface 6.
| JPH06232429A | 1994-08-19 | |||
| JP2005035814A | 2005-02-10 | |||
| JPH1053488A | 1998-02-24 | |||
| JP2002237465A | 2002-08-23 | |||
| JPS59152734U | 1984-10-13 |
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai
Next Patent: FERTILIZER FOR RAISING LAWN AND METHOD FOR RAISING LAWN