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Title:
SUBSTRATE BEFORE INSULATION PROCESSING, ITS MANUFACTURING METHOD, SURFACE ACOUSTIC WAVE VIBRATOR, MANUFACTURING METHOD THEREOF, SURFACE ACOUSTIC WAVE DEVICE AND ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2006210476
Kind Code:
A
Abstract:

To provide a substrate before insulation processing having a protection film with high productivity and sufficient adhesive strength to the insulation processing; and to provide a manufacturing method of the substrate where only a desired range in a substrate surface is insulated, a manufacturing method of a surface acoustic wave vibrator, the surface acoustic wave vibrator manufactured by the manufacturing method, a surface acoustic wave device, and an electronic apparatus.

The manufacturing method of the substrate comprises a first process for heating a substrate 11 comprising a part having conductivity on a surface, a second process (Figure (b)) giving function liquid 30A on the substrate 11 so that a part of the part having conductivity is covered, a third process (Figure (c)) drying function liquid 30A and forming the substrate before insulation processing 12 which has the protection film 30 where a periphery-like outer edge is relatively thicker than a region except for the periphery-like outer edge on a surface, a fourth process (Figure (d)) performing the insulation processing on the surface of the substrate before insulation processing 12, and a fifth process (Figure (e)) peeling the protection film 30.


Inventors:
HASEI HIRONOBU
Application Number:
JP2005017923A
Publication Date:
August 10, 2006
Filing Date:
January 26, 2005
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
H01L21/475; B05D1/26; B05D5/12; H01L41/22; H01L41/311; H03H3/08; H05K1/09
Attorney, Agent or Firm:
Masahiko Ueyanagi
Fujitsuna Hideyoshi
Osamu Suzawa