Title:
SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD
Document Type and Number:
Japanese Patent JP2008029990
Kind Code:
A
Abstract:
To provide a substrate cleaning apparatus, which effectively removes a foreign substance adhered to a flexible substrate and makes the removed foreign substance hard to adhere again, and to provide a substrate cleaning method using the same apparatus.
The substrate cleaning apparatus has a cleaning part 20 which cleans the flexible substrate 1 to be transported and a drying part 40, which is arranged downstream of the cleaning part 20 and dries the cleaned substrate 1. The substrate 1 is transported with the width direction turned in the vertical direction at least when it is transported to the cleaning part 20.
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Inventors:
YAMAZAKI MASAYASU
SUZUKI TOSHIYUKI
SUZUKI TOSHIYUKI
Application Number:
JP2006208373A
Publication Date:
February 14, 2008
Filing Date:
July 31, 2006
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
B08B11/00; B08B3/02
Attorney, Agent or Firm:
Kenji Yoshitake
Hiroyuki Nagai
Junpei Okada
Hirohito Katsunuma
Hiroyuki Nagai
Junpei Okada
Hirohito Katsunuma
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