Title:
SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD
Document Type and Number:
Japanese Patent JP2023156161
Kind Code:
A
Abstract:
To reduce the damage to a substrate caused by the supply of cleaning solution by lowering the fluid pressure of the cleaning solution supplied to the substrate, and to prevent detachment of electronic components, etc., which have weak adhesion to the substrate.SOLUTION: An apparatus for cleaning a substrate W by supplying cleaning solution L to the rotating substrate W comprises a table 10 on which the substrate W is placed and rotates, and a spray nozzle 40 installed with the spray direction D of the cleaning solution L off the substrate W, and the mist m of the cleaning solution L ejected from the spray nozzle 40 falls onto the substrate W to supply the cleaning solution L to the substrate W on the table 10.SELECTED DRAWING: Figure 1
Inventors:
YAMADA YOSHIHIRO
Application Number:
JP2022065855A
Publication Date:
October 24, 2023
Filing Date:
April 12, 2022
Export Citation:
Assignee:
AIMECHATEC LTD
International Classes:
H01L21/304; B08B3/02; B08B5/02
Attorney, Agent or Firm:
Kazuya Nishi