Title:
基板洗浄装置および基板洗浄方法
Document Type and Number:
Japanese Patent JP7224403
Kind Code:
B2
Abstract:
Providing a substrate cleaning device and a substrate cleaning method having high detergency. Provided is a substrate cleaning device including: a substrate rotating mechanism that rotates a substrate; and a first nozzle and a second nozzle that eject an ultrasonic cleaning solution toward a predetermined surface of the substrate that is rotated, wherein the first nozzle and the second nozzle are held in one casing.
Inventors:
Tomohisa Ishibashi
Application Number:
JP2021124365A
Publication Date:
February 17, 2023
Filing Date:
July 29, 2021
Export Citation:
Assignee:
Ebara Corporation
International Classes:
H01L21/304
Domestic Patent References:
| JP2006310456A | ||||
| JP2008036557A | ||||
| JP2017162889A | ||||
| JP2000216126A |
Attorney, Agent or Firm:
Seiji Ohno
Hideki Kobayashi
Hiroyuki Ohno
Ibuka Dai
Morita Koji
Rika Fukami
Tomohiro Matsuno
Seiichi Sakatani
Hiroshi Nomoto
Hideki Kobayashi
Hiroyuki Ohno
Ibuka Dai
Morita Koji
Rika Fukami
Tomohiro Matsuno
Seiichi Sakatani
Hiroshi Nomoto