To provide a substrate cleaning brush for use in manufacture of a substrate for a semiconductor device which can prevent entangling of brush bristles, increase a substrate cleaning performance, prolong the life of the substrate cleaning brush, and reduce a cleaning cost involved by increasing a cleaning quality.

In the substrate cleaning brush, a channel brush is manufactured by coating a bundle of a predetermined number of brush bristles with a pipe-shaped soft resin material and inserting the bundle into a channel base with a core metal disposed in the bundle. Such channel brushes are mounted on a cylindrical brush shaft sequentially from its ahead side to a back side as in a coil winding manner, so that the entire surface of the brush shaft is fully covered with the channel brushes. Since the brush bristles are covered with the adjacent pipe-shaped flexible resin materials, the brush bristles are prevented from being entangled with each other.