Title:
SUBSTRATE CLEANING DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2004311592
Kind Code:
A
Abstract:
To obtain a substrate cleaning device for making a film thickness after cleaning a substrate uniform in the plane when the thickness of laminated films cannot be made uniform because reaction of a gas for forming films on the substrate is not uniform.
A substrate is held with a gap so as to oppose a plurality of heating/cooling members capable of being set at different temperatures, and the gap is filled with a cleaning liquid. A resin-made chuck pin having low thermal conductivity is used to hold the substrate, and the substrate is arranged so as not to make contact with a member other than the chuck pin.
Inventors:
TANAKA HIROSHI
Application Number:
JP2003100703A
Publication Date:
November 04, 2004
Filing Date:
April 03, 2003
Export Citation:
Assignee:
RENESAS TECH CORP
International Classes:
G01L21/30; G01R31/00; H01L21/00; H01L21/683; H01L21/304; H01L21/306; H01L21/68; (IPC1-7): H01L21/304; H01L21/306; H01L21/68
Attorney, Agent or Firm:
Kuro Fukami
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai