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Title:
基板洗浄方法、基板洗浄システムおよび記憶媒体
Document Type and Number:
Japanese Patent JP6945320
Kind Code:
B2
Abstract:
To increase productivity.SOLUTION: A substrate processing method comprises: a film-forming process liquid supplying step of supplying film-forming process liquid including a polar organic material to a substrate including Ge or III-group V material, provided that in the substrate, a wiring pattern made of a metal material is at least partially exposed by dry etching or ashing; a volatilization step of volatilizing a volatile component; a step of putting, into a transport container, the substrate of which the wiring pattern is isolated from ambient air as a result of formation of a process film; a taking step of taking out the substrate in the transport container; and a peeling liquid supplying step of supplying the process film with peeling liquid containing a nonpolar solvent and a polar organic solvent after the taking step. The peeling liquid contains not water content, but the polar organic solvent so that the polar organic solvent slightly dissolves the process film and the nonpolar solvent permeates into an interface between the process film and the substrate.SELECTED DRAWING: Figure 4

Inventors:
Kenji Sekiguchi
Tomoyuki Sugano
Aihara Akinori
Kozo Tachibana
Application Number:
JP2017066950A
Publication Date:
October 06, 2021
Filing Date:
March 30, 2017
Export Citation:
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Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/304; C11D9/26
Domestic Patent References:
JP2015119164A
JP2011139004A
JP2014123704A
JP2015046442A
Attorney, Agent or Firm:
Sakai International Patent Office