Title:
金属を用いた基板の被覆方法
Document Type and Number:
Japanese Patent JP4044286
Kind Code:
B2
Abstract:
A process for coating substrates having polymer surfaces with metals in the manufacturing of printed circuit boards, in particular in the manufacturing of printed circuit boards having microscopic holes and fine geometries by the application of an electroconductive polymer layer and a subsequent metallization, wherein the electroconductive polymer layer is preferably doped with a zinc-containing, colloidal palladium solution prior to the metallization step, the electroconductive polymer is poly-3,4-ethylenedioxythiophene and a contacting with a copper(II) salt solution is performed prior to the metallization.
Inventors:
Hupe Jurgen
Fix sabin
Steinius Ortold
Fix sabin
Steinius Ortold
Application Number:
JP2000549789A
Publication Date:
February 06, 2008
Filing Date:
May 14, 1999
Export Citation:
Assignee:
Brasberg Oberfrecken Technik Gezel Shaft Mitt Beschlenktel Haftung
International Classes:
H05K3/18; C23C18/16; H05K3/42; C25D1/00; C25D5/56; C25D7/00; C25D21/14; H05K3/24
Attorney, Agent or Firm:
Toshio Shiozawa
Masazumi Imamura
Junji Kamata
Masazumi Imamura
Junji Kamata