Title:
Substrate conveying method
Document Type and Number:
Japanese Patent JP6190645
Kind Code:
B2
Inventors:
Takehiro Shindo
Application Number:
JP2013143899A
Publication Date:
August 30, 2017
Filing Date:
July 09, 2013
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/677
Domestic Patent References:
| JP2000294619A | ||||
| JP9270450A | ||||
| JP4180246A | ||||
| JP9293772A | ||||
| JP11160058A | ||||
| JP2012129248A | ||||
| JP2008300609A | ||||
| JP2010199478A | ||||
| JP2009059741A |
Foreign References:
| US20090142163 |
Attorney, Agent or Firm:
Hiroaki Sakai
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