Title:
SUBSTRATE CRACK DETECTION STRUCTURE
Document Type and Number:
Japanese Patent JP2015070076
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate crack detection structure which allows for detection of problems, e.g., cracking or chipping of a component fixing hole after fixing the fittings to a wiring board, while maintaining the quality of the wiring board.SOLUTION: A substrate crack detection structure includes a component fixing hole 65 formed in a wiring board 11, and a conductor foil pattern 69 disposed tightly to the wiring board 11 so as to surround the component fixing hole 65 along an opening edge 71 thereof, and having both ends opened electrically.
Inventors:
HIRAOKA OSAMU
Application Number:
JP2013202164A
Publication Date:
April 13, 2015
Filing Date:
September 27, 2013
Export Citation:
Assignee:
YAZAKI CORP
International Classes:
H05K1/11; H01L23/12
Attorney, Agent or Firm:
Patent business corporation glory patent office
Hironori Honda
Kiharu Masaharu
Hironori Honda
Kiharu Masaharu