Title:
SUBSTRATE CUTTING METHOD AND DEVICE
Document Type and Number:
Japanese Patent JP3618945
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To enable a substrate to be accurately cut, by a method wherein the position of a guide line provided for a slice line us detected, and the substrate is cut off along the slice line as corrected on a cutting position.
SOLUTION: A slice line 101 and a guide line 102 are provided onto the surface of a substrate. The guide line 101 and the guide line 102 are formed of electrode layers formed at the same time in parallel with a first electrode or a second electrode which is comprised in a thin film field effect transistor or a sensor or the first electrode or the second electrode. Light reflected from the guide line 101 is monitored with a detector while the slice line 101 is cut off. After the cutting of the slice lines 101 on the substrate is finished, the guide line 102 starts being cutting. At this point, the detector is not in operation. By this setup, the adjacent sides of a substrate are accurately cut off.
Inventors:
Tomomi Koshi Akira
Chiori Mochizuki
Chiori Mochizuki
Application Number:
JP2783797A
Publication Date:
February 09, 2005
Filing Date:
February 12, 1997
Export Citation:
Assignee:
Canon Inc
International Classes:
G01T1/20; B23D59/00; B28D5/00; H01L21/301; H01L27/146; (IPC1-7): H01L21/301; B28D5/00; G01T1/20; H01L27/146
Domestic Patent References:
| JP5640979B2 | ||||
| JP393251A |
Attorney, Agent or Firm:
Jyohei Yamashita