Title:
SUBSTRATE CUTTING METHOD
Document Type and Number:
Japanese Patent JP2003285207
Kind Code:
A
Abstract:
To remove chips of a substrate produced when the substrate is cut.
A cutting target position of the substrate 8 and an acute-angled part 2 are aligned by moving a traveling means 7. Then, a switch 9 is switched on and a cutting member 3 is moved downward toward the substrate 8 by an operating means 10 while giving ultrasonic vibration generated by an ultrasonic vibration generating means 1. The acute-angled part 2 is pressed downward by a specified depth to cut the substrate 8. In this way, a cutting method that suppresses the production of chips is materialized.
Inventors:
SHIGETOMI TAKAHIRO
Application Number:
JP2002085257A
Publication Date:
October 07, 2003
Filing Date:
March 26, 2002
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B23B37/00; B23B41/00; B26F1/26; (IPC1-7): B23B37/00; B23B41/00; B26F1/26
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)