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Title:
SUBSTRATE DIVIDING MACHINE
Document Type and Number:
Japanese Patent JPH06238595
Kind Code:
A
Abstract:

PURPOSE: To prevent the slip-off of an installed part by oppositely setting the upper and lower cutters, having a dividing line which is formed from the sewing machine perforation and formed on a printed substrate and cutting the substrate along the division line by the lowering of the upper cutter, and at the same time, by bending-removing the edge plate at the edge part of the substrate.

CONSTITUTION: The lower mold 11 of a substrate dividing machine supports the inside undersurface of a V groove 16 for the division to the outside edge plate and the center part of a substrate 15 by a substrate placing board 14 positioned at the edge, and a positioning rod 13a which is erected from the proper place of the base board 13 extended on the periphery of the placing board 14 and carries out positioning for the upper and lower molds, lower cutter 17, and a stopper 28 for restricting the lowering of the upper mold 12 are provided. While, the upper mold 12 is assembled with a free elevator frame 19, and is equipped with a stopper plate 20 and a holder base 21, and the upper cutter 24 is fixed on a slide plate 23 suspended by a spring 22. The substrate 15 is cut along a dividing line by the lowering of the upper mold 12, and at the same time, the edge plate 15a is bending-removed.


Inventors:
WATABE SHINJI
Application Number:
JP4721493A
Publication Date:
August 30, 1994
Filing Date:
February 12, 1993
Export Citation:
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Assignee:
TOYO COMMUNICATION EQUIP
International Classes:
B26D1/08; B26D7/18; B26D9/00; B26F3/00; H05K3/00; (IPC1-7): B26D9/00; B26D1/08; B26D7/18; B26F3/00; H05K3/00
Attorney, Agent or Firm:
Suzuki Hitoshi



 
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