Title:
基板乾燥装置
Document Type and Number:
Japanese Patent JP6580177
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate drying apparatus which allows for elimination of droplets remaining on a substrate after drying processing by an air knife.SOLUTION: A substrate drying apparatus for drying a substrate 11 by injecting gas from air knives 33 and 34 to the substrate 11 conveyed after being cleaned, at an angle inclining from a direction perpendicular to a surface of the substrate 11 to a downstream side in a conveyance direction 14 of the substrate 11, includes air blow nozzles 35 and 36 for injecting gas toward at least one surface of the substrate 11 on the downstream side in the conveyance direction 14 of the substrate 11 than a position, where the air knives 33 and 34 are arranged. The air blow nozzles 35 and 36 are configured to inject the gas to the substrate 11 at an angle different from that of the air knives 33, and 34.SELECTED DRAWING: Figure 2A
Inventors:
Kenji Sakashita
Akinori Iso
Yukinobu Western
Ryuhei Takahara
Takahiro Hamada
Rie Teshima
Akinori Iso
Yukinobu Western
Ryuhei Takahara
Takahiro Hamada
Rie Teshima
Application Number:
JP2018031759A
Publication Date:
September 25, 2019
Filing Date:
February 26, 2018
Export Citation:
Assignee:
Shibaura Mechatronics Co., Ltd.
International Classes:
H01L21/304; B08B1/02; B08B1/04; B08B3/02; B08B5/02; F26B5/00; F26B15/12; G02F1/13; G02F1/1333
Domestic Patent References:
JP7294124A | ||||
JP5261718A | ||||
JP11298139A | ||||
JP9246229A | ||||
JP2010181761A |