Title:
基板乾燥装置
Document Type and Number:
Japanese Patent JP7356368
Kind Code:
B2
Abstract:
An aspect of the disclosure provides a substrate drying apparatus. The substrate drying apparatus includes: a gripping part, gripping an outer periphery part of a substrate that is square; a substrate nozzle, ejecting gas to the substrate gripped by the gripping part to dry the substrate; and a gripping part nozzle, ejecting gas to the gripping part to dry the substrate. The substrate nozzle is relatively movable with respect to the substrate in a first direction, and is able to eject the gas in the first direction toward the substrate. The gripping part nozzle is relatively movable with respect to the substrate in the first direction, and is able to eject the gas in a second direction intersecting with the first direction. The gripping part nozzle is disposed behind the substrate nozzle in the first direction.
Inventors:
Hiroshi Ohashi
Takuya Sakuma
Takuya Sakuma
Application Number:
JP2020020565A
Publication Date:
October 04, 2023
Filing Date:
February 10, 2020
Export Citation:
Assignee:
Ebara Corporation
International Classes:
H01L21/304; C25D21/00; F26B15/12
Domestic Patent References:
| JP2017154111A | ||||
| JP2001050660A | ||||
| JP2015192141A | ||||
| JP2002158205A | ||||
| JP11214349A |
Foreign References:
| US6418640 |
Attorney, Agent or Firm:
Patent Attorney Firm Interbrain
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