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Title:
SUBSTRATE-DRYING METHOD AND SUBSTRATE-DRYING EQUIPMENT
Document Type and Number:
Japanese Patent JP2003077883
Kind Code:
A
Abstract:

To provide a substrate-drying method and substrate-drying equipment where the consumption of air can be reduced and irregularities of drying can be restrained.

The quantity of air spouted from air knives 53a, 53b is made greater than that of the time of waiting, and treatment liquid stuck on a region Ga in the vicinity of a front end of a substrate G is removed. After a prescribed time has passed starting from when a sensor S detects the front end of the substrate, at a region Gc except the regions in the vicinities of the front end and a rear end of the substrate, air is spouted whose spouting quantity is smaller than that of the region Ga, and the treatment liquid is removed. After a prescribed time has passed again from when the sensor S detects the front end of the substrate, the treatment liquid stuck on a region Gb in the vicinity of the rear end of the substrate G is removed. As a result, the removal is enabled completely all over the whole surface of the substrate without generating irregularities, and the generation of drying nonuniformity can be prevented. Further, the spouting quantity of air in the region Gc can be reduced.


Inventors:
Shinozaki, Masaya
Sada, Tetsuya
Nakamitsu, Takashi
Tsuruta, Shigeto
Application Number:
JP2001000268424
Publication Date:
March 14, 2003
Filing Date:
September 05, 2001
Export Citation:
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Assignee:
TOKYO ELECTRON LTD
International Classes:
F26B5/14; F26B9/06; F26B15/12; H01L21/304; F26B5/00; F26B9/06; F26B15/00; H01L21/02; (IPC1-7): H01L21/304; F26B5/14; F26B9/06; F26B15/12