Title:
基板乾燥処理装置及び基板乾燥処理方法
Document Type and Number:
Japanese Patent JP3627132
Kind Code:
B2
Abstract:
A substrate transporting device and method 19 transports a plurality of wafers W standing upright in a row, from a previous process, i.e., a cleaning process. A substrate holder 40 is carried by a transporting device 50 arranged outside a drying chamber 20. The substrate holder 40 receives the wafers W from the substrate transporting device 19 while maintaining a posture of the wafers W. The transporting device 50 lowers the substrate holder 40 and sequentially moves it into the drying chamber 20 through an unloading and loading port 21 above the drying chamber 20. Thereafter, the substrate holder 40 is fixed to a rotor 30. After closing the unloading and loading port 21 with a lid body 25, the rotor 30 is rotated. In this way, moisture sticking to surfaces of the wafers W is eliminated.
Inventors:
Honda Yoshiyuki
Takaguchi Rei
Eiji Masuda
Takaguchi Rei
Eiji Masuda
Application Number:
JP20261198A
Publication Date:
March 09, 2005
Filing Date:
July 17, 1998
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
F26B11/04; H01L21/00; H01L21/304; H01L21/683; (IPC1-7): H01L21/304; F26B11/04; H01L21/68
Domestic Patent References:
| JP7022378A | ||||
| JP6061332A | ||||
| JP59039623A | ||||
| JP6112186A | ||||
| JP6017230U | ||||
| JP4048622U | ||||
| JP7254584A | ||||
| JP6260473A | ||||
| JP6177110A |
Attorney, Agent or Firm:
Kikuhiko Nakamoto