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Title:
SUBSTRATE FIRING DEVICE
Document Type and Number:
Japanese Patent JP2010014397
Kind Code:
A
Abstract:

To provide a substrate firing device having an increased contact area between a substrate and substrate support portions, thereby preventing generation of scratches on the substrate while the substrate support portions contract and expand due to increasing and lowering of the internal temperature of the firing device.

The substrate firing device is provided with a heating portion 21 supplying heat to inside of a firing furnace 10 to heat the substrate S at the firing temperature; first support portions 30 each of which has a support frame 30a installed horizontally on the inner face to place the substrate S and at least one support pin 30b protruded from one region of the support frame 30a toward the central part side and which are installed at fixed intervals vertically and are made of quartz; and second support portions 40 made of quartz, arranged on the support pins 30b of the first support portions 30 and installed so that only fixed regions are brought into contact with the lower faces of the substrates S.


Inventors:
Jung, Won-woong
Shin, Genchuru
Application Number:
JP2009000004032
Publication Date:
January 21, 2010
Filing Date:
January 09, 2009
Export Citation:
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Assignee:
SAMSUNG MOBILE DISPLAY CO LTD
International Classes:
F27B5/06; F27B17/00; F27D1/18; F27D5/00; F27D11/02
Domestic Patent References:
JP2001328870A
JP2007084111A
JP2007230801A
JP2007230801A
JP2001328870A
JP2007084111A
Attorney, Agent or Firm:
佐伯 義文
渡邊 隆
村山 靖彦