To provide a substrate fixing device for a thin-film vapor deposition device and a substrate fixing method using the substrate fixing device.
The substrate fixing device for the thin-film vapor deposition device contains a mask pressurization plate which is located on the substrate and moves toward the substrate and which is allowed to contact with the substrate in a prescribed pressure, a magnetic body which is located on the mask pressurization plate, moves toward the mask pressurization plate so that the mask may be stuck on the substrate by using magnetic force and a driving means for moving the magnetic body. Thereby, alignment of the mask to the substrate is not collapsed since the mask pressurization plate is tightly adhered to the substrate each other, the magnetic body is dropped to the back surface of the substrate supported with the mask pressurization plate, the mask located at the lower part of the substrate is tightly adhered and fixed to the front surface of the substrate by the magnetic force of the magnetic body and supports the substrate with multi-stage.
JANG YONG WEON
KIM TAE SEUNG
JP2002075638A | 2002-03-15 | |||
JP2002212704A | 2002-07-31 | |||
JP2002075638A | 2002-03-15 | |||
JP2002212704A | 2002-07-31 |
US4599970A | 1986-07-15 | |||
US4599970A | 1986-07-15 |
Shiro Takayanagi
Yasuhiro Otsuka
Shuji Kimura