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Title:
基板異物除去装置
Document Type and Number:
Japanese Patent JP5263604
Kind Code:
B2
Abstract:

To provide an apparatus for removing foreign matter on a printed circuit board for effectively removing foreign matters such as dust or the like adhered to the printed circuit board.

An aperture 14a is formed at the bottom part of a shroud 14 at the lower part of a case Ac and a roll brush 12 within the case is exposed to the lower side from the aperture 14a. A separating wall 25 is provided to be freely movable in the direction of a rotating axis X within the case Ac and an exhausting cylinder 13 is provided to be freely movable in the direction of the rotating axis X at the upper part of the case Ac. A position adjusting device D is provided to set the exhausting cylinder 13 to the central position in the width direction of the printed circuit board P based on the location of end part of the printed circuit board P. Moreover, a cooperation work mechanism E is also provided to set the separating wall 25 at the location of end part of the printed circuit board P.

COPYRIGHT: (C)2010,JPO&INPIT


Inventors:
Fumio Makimoto
Takahiro Hirota
Application Number:
JP2009013302A
Publication Date:
August 14, 2013
Filing Date:
January 23, 2009
Export Citation:
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Assignee:
Aisin Seiki Co., Ltd.
International Classes:
H05K3/26; B08B1/02; B08B1/04; B08B5/04
Domestic Patent References:
JP2007027457A
JP2007281295A
JP2003334499A
JP4153514B2
Attorney, Agent or Firm:
Shuichiro Kitamura
Mountain Saki Tetsuya