Title:
基板の異物質検査方法
Document Type and Number:
Japanese Patent JP6425755
Kind Code:
B2
Abstract:
In order to inspect a substrate, an image information of a substrate before applying solder is displayed. Then, at least one inspection region on the substrate is image-captured to obtain an image of the inspection region that is image-captured. Then, image information that is to be displayed is renewed and the renewed image information is displayed. And, in order to inspect a foreign substance, obtained image of the inspection region is compared with a reference image of the substrate. Therefore, an operator can easily catch a region corresponding to a specific region of the image that is displayed, and easily detect a foreign substance on the substrate.
Inventors:
Li, Hyun-suk
Yang, Jae-sik
Kim, jerk
Kim, hey
Yoo, Heo-Wuk
Yang, Jae-sik
Kim, jerk
Kim, hey
Yoo, Heo-Wuk
Application Number:
JP2017057243A
Publication Date:
November 21, 2018
Filing Date:
March 23, 2017
Export Citation:
Assignee:
Co Young Technology Incorporated
International Classes:
G01N21/956; G01B11/24; G06T1/00
Domestic Patent References:
| JP10150299A | ||||
| JP2007074770A1 | ||||
| JP2004125434A | ||||
| JP2012108134A |
Foreign References:
| US20080285840 |
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Kato Kazunori