SUBSTRATE FOR FORMING TRANSPARENT CONDUCTIVE PATTERN, SUBSTRATE WITH TRANSPARENT CONDUCTIVE PATTERN FORMED THEREIN, AND METHOD FOR MANUFACTURING SUBSTRATE WITH TRANSPARENT CONDUCTIVE PATTERN FORMED THEREIN

Title:

Document Type and Number:

Japanese Patent JP2014208469

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To provide a substrate for forming a transparent conductive pattern, which ensures adhesiveness of a transparent conductive layer containing metal nanowires to a glass substrate, a high heat-resistant (thermosetting) resin substrate or a crystalline thermosetting resin substrate, and to provide a substrate with a transparent conductive pattern formed therein and a method for manufacturing a substrate with a transparent conductive pattern formed therein.SOLUTION: A transparent resin layer 12 comprising a non-crystalline thermoplastic resin having Tg of 200°C or lower or a curable resin prepolymer having Tg of 200°C or lower and not three-dimensionally crosslinked prior to photo-calcination, is formed on a surface of a substrate 10. Metal nanowires and/or metal nanotubes are deposited on the transparent resin layer 12, and the deposited metal nanowires are irradiated with pulse light having a pulse width of 20 microseconds to 50 microseconds to form a transparent conductive pattern 14 containing the metal nanowires.

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Inventors:

UCHIDA HIROSHI

Application Number:

JP2014062375A

Publication Date:

November 06, 2014

Filing Date:

March 25, 2014

Export Citation:

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Assignee:

SHOWA DENKO KK

International Classes:

B32B7/02; H01B3/40; H01B3/44; H01B5/14; H01B13/00; H01B17/60; H05K1/09

Domestic Patent References:

JP2012527071A	2012-11-01
JP2009129607A	2009-06-11
JP2014133356A	2014-07-24
JP2009094033A	2009-04-30

Foreign References:

WO2007022226A2	2007-02-22
US20120118617A1	2012-05-17

Attorney, Agent or Firm:

Motoji Arihara
Nobutoshi Takei

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