Title:
SUBSTRATE GRINDING METHOD AND DEVICE THEREOF
Document Type and Number:
Japanese Patent JP3944260
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate grinding method and its device capable of ensuring uniform surface grinding even in the peripheral part of a semiconductor substrate in particular.
SOLUTION: While interposing abrasive cloth 13 in space between a work W held by a base plate 11 and a surface plate 12, a surface of this substrate W is ground, forming a flat surface form. The surface plate 12 is not to the same form as the substrate 11 and equal to size or less than that, and the substrate W is pressurized and ground by the abrasive cloth 13. The substrate W is thus pressurized and ground as making it relatively move between at least the substrate W and the abrasive clothe 13. This device is provided with a temperature control means 15 for controlling a temperature of the base plate 11 and/or the surface plate 12. The work is ground with uniform abrasive pressure in a central part and a peripheral part of the substrate W, thereby uniformizing a substrate surface into flatness.
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Inventors:
Hirohiko Izumi
Application Number:
JP10374596A
Publication Date:
July 11, 2007
Filing Date:
March 29, 1996
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
B24B37/12; B24B37/20; B24B37/24; H01L21/304; (IPC1-7): B24B37/04; B24B37/00; H01L21/304
Domestic Patent References:
| JP7276225A | ||||
| JP7111256A | ||||
| JP48033491A | ||||
| JP7223160A | ||||
| JP62153047U | ||||
| JP2110333U |
Attorney, Agent or Firm:
Takayoshi Kokubun
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