Title:
基板の研削方法
Document Type and Number:
Japanese Patent JP7362207
Kind Code:
B2
Abstract:
A method of grinding a substrate includes grinding the substrate to a larger depth at an outer circumferential portion of the substrate than at a central portion of the substrate by keeping an annular grindstone assembly of a grinding unit and the substrate in abrasive contact with each other while a portion of a holding surface of a chuck table underlying an area of contact between the annular grindstone assembly and the substrate is lying not parallel to a grinding surface defined by a lower surface of the annular grindstone assembly, lifting the grinding unit to separate the annular grindstone assembly from the substrate, and, grinding the substrate by keeping again the annular grindstone assembly and the substrate in abrasive contact with each other by lowering the grinding unit while the portion of the holding surface is lying parallel to the grinding surface.
Inventors:
Hiroshi Kurokawa
Soichi Matsubara
Soichi Matsubara
Application Number:
JP2019183133A
Publication Date:
October 17, 2023
Filing Date:
October 03, 2019
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
B24B7/04; B24B41/06; H01L21/304
Domestic Patent References:
| JP2018020398A | ||||
| JP2011206867A | ||||
| JP2009176848A |
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano